I like the idea but the real problem is heat soak of the UIM & LIM. No matter how much you cool the IC piping, the manifolds are going to reheat the air substancially before it enters the engine. The conducted heat from the engine is what causes the manifolds to get hot. Thats why I wish someone would make a carbon fiber LIM & UIM for rotarys. Cold manifolds is where the power is at. I feel this is where you should apply this idea of yours.